job posting · smartrecruiters
SANDISK CORP: Senior Principal AI Interconnect Architect
Observed on the employer’s careers system, last checked 2026-09-03.
- Employer
- SANDISK CORP
- Location
- Milpitas
- Category
- Engineering
- Posted
- 2026-08-04
- Careers system
- smartrecruiters
- Observed
- 2026-09-03
Role description
Verbatim from the employer’s posting, rendered as plain text.
An AI Interconnect Architect defines and engineers high-speed networking and communication systems for AI Inference infrastructure which include servers, racks, and chips with a focus on bandwidth, power efficiency, scalability, and optimized transport protocols. Design solutions should take into account interconnect technologies such as PCIe, CXL, co-packaged optics, UALink, Ultra Ethernet, and be able to specify innovative scale-out architectures for optimizing power, cost, and performance. Essential Duties and Responsibilities: System Architecture & Design: Develop architectures for chip-to-chip interconnects and switched fabrics tailored for AI/ML scale-out. Performance Optimization: Analyze trade-offs in bandwidth, latency, power, area, and reliability. Technology development and standards: Participate in industry standard bodies and contribute/influence/shape the direction of…
Provenance
744000141408989