job posting · smartrecruiters
SANDISK CORP: Packaging Engineer (Substrate Design and Layout, Only open for fresh graduate)
Observed on the employer’s careers system, last checked 2026-09-12.
- Employer
- SANDISK CORP
- Location
- Taichung
- Category
- Engineering
- Posted
- 2026-09-11
- Careers system
- smartrecruiters
- Observed
- 2026-09-12
Role description
Verbatim from the employer’s posting, rendered as plain text.
Participate in the development of package design and advanced substrate layout for products. Learn and become proficient in EDA layout tools (e.g., Cadence SIP/Allegro) to perform package and substrate drawing, design modifications, and related engineering tasks. Perform basic routing planning, layer stack‑up configuration, and design‑for‑manufacturability (DFM) checks based on established design rules and manufacturing requirements. Collaborate with cross‑functional engineering teams—including hardware, manufacturing, and packaging—to support package structure evaluations, design updates, and issue resolution. Required Qualifications: Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, or other related engineering/science fields. Coursework, project experience, or internships related to semiconductor…
Provenance
744000148974804