job posting · smartrecruiters
SANDISK CORP: Engineer, Packaging Engineering (Mechanical Design)
Observed on the employer’s careers system, last checked 2026-09-03.
- Employer
- SANDISK CORP
- Location
- Batu Kawan
- Category
- Engineering
- Posted
- 2026-07-20
- Careers system
- smartrecruiters
- Observed
- 2026-09-03
Role description
Verbatim from the employer’s posting, rendered as plain text.
ESSENTIAL DUTIES AND RESPONSIBILITIES: As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level. The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques. The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. REQUIRED: B.S. in Mechanical Engineering plus 5 years, of relevant industry experience Solid knowledge through academic coursework or experience required in Mechanical design Proficiency in CAD software (e.g. SolidWorks, Autocad) Knowledge of engineering drafting standards and tolerance analysis A strong background in mechanical design with…
Provenance
744000138562614