job posting · smartrecruiters
SANDISK CORP: Senior Engineer, Packaging Engineering (FIB)
Observed on the employer’s careers system, last checked 2026-09-03.
- Employer
- SANDISK CORP
- Location
- Batu Kawan
- Category
- Engineering
- Posted
- 2026-08-26
- Careers system
- smartrecruiters
- Observed
- 2026-09-03
Role description
Verbatim from the employer’s posting, rendered as plain text.
We are seeking an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. This role is part of the Chip Package Integration (CPI) Failure Analysis function and plays a key role in improving device reliability and influencing package and product design. The position interfaces closely with wafer fabrication (NAND and ASIC), package and product design teams, electrical and physical characterization, assembly R&D, and other process engineering groups. ESSENTIAL DUTIES AND RESPONSIBILITIES: Develop and maintain package recipe and process baselines based on FA findings. Collaborate with fab process, package design, assembly R&D, and characterization teams. Evaluate package reliability and robustness in response to fab process changes. Lead package evaluation and qualification for…
Provenance
744000145671339