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job posting · smartrecruiters

SANDISK CORP: Engineer, Packaging Developing Engineering

Observed on the employer’s careers system, last checked 2026-09-03.

POSTED: 2026-07-30Listed

Cite: FACTANKER, https://factanker.com/jobs/posting/17b3536a-ea98-4ece-a1e4-382a1f05ffb9

Employer
SANDISK CORP
Location
Shanghai
Category
Engineering
Posted
2026-07-30
Careers system
smartrecruiters
Observed
2026-09-03

Apply on the employer’s site ↗

Role description

Verbatim from the employer’s posting, rendered as plain text.

SIP assembly process and packaging engineer, BGA/LGA products packaging, especially for molding process. Develop and optimize new process recipes to achieve high capability for future products. Evaluate and introduce advanced packaging process technology. Collaborate with material/equipment team to develop new material/equipment technology. Work with the global team on new product design, evaluation, and introduction. Partner with the Pathfinding team to achieve leading PKG technology targets. REQUIRED: Master or above, major in Organic Materials Science and Engineering, materials chemistry, etc. Good communication skill and team work spirit, willing to work under certain pressure. PREFERRED: Strong Knowledge at SIP packaging. Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (Or other similar statistic software, Spot-fire) etc. Familiar with one of programming language will be a…

Provenance

Official posting
https://jobs.smartrecruiters.com/Sandisk/744000140570509
Retrieved
2026-09-13 08:45:00.598816+02:00
ATS reference
744000140570509