| 3DIC Platform Wet and Plating Development Manager | US, Oregon, Hillsboro | — | 2026-10-26 |
| Accountant | India, Bangalore | — | 2026-10-26 |
| Accountant | Malaysia, Penang | — | 2026-10-26 |
| Accountant | Malaysia, Penang | — | 2026-10-26 |
| Accountant (Statutory compliance) | Malaysia, Penang | — | 2026-10-26 |
| Accounting Technical Specialist | Malaysia, Penang | — | 2026-10-26 |
| ADCE Packaging Design Architect | US Arizona Phoenix | — | 2026-10-26 |
| Advanced Packaging Materials Sr. Commodity Manager | Japan Tokyo | — | 2026-10-26 |
| Advanced Packaging Metrology Engineering Manager | US, Oregon, Hillsboro | — | 2026-10-26 |
| Advanced Packaging Module Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Advanced Packaging Process Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Advanced Packaging Quality and Reliability Engineer | US, New Mexico, Albuquerque | — | 2026-10-26 |
| Advanced Packaging Substrate Supplier Enablement Lead | US, Arizona, Phoenix | — | 2026-10-26 |
| Advanced Packaging TD Plating Module Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Advanced Packaging TD/Substrate Finance Specialist | US Arizona Phoenix | — | 2026-10-26 |
| Advanced Packaging Top Die Module Engineer | US, New Mexico, Albuquerque | — | 2026-10-26 |
| Advance Packaging Material Supply Chain Engineer | Japan Tokyo | — | 2026-10-26 |
| AI Application Development Intern | PRC, Shanghai | — | 2026-10-26 |
| AI Data Science / Software Engineering PhD Intern New 2027 | US, Oregon, Hillsboro | — | 2026-10-26 |
| AI Data Science / Software Engineering PhD Intern New 2027 | US, Oregon, Hillsboro | — | 2026-10-26 |
| AI Data Science / Software Engineering PhD Intern New 2027 | US, California, Santa Clara | — | 2026-10-26 |
| AI Data Science / Software Engineering PhD Intern New 2027 | US, Oregon, Hillsboro | — | 2026-10-26 |
| AI Developer Relations - Docs and Learning Experience | US Arizona Phoenix | — | 2026-10-26 |
| AI-Driven Physical Design Engineering (PhD Intern) | US California Santa Clara | — | 2026-10-26 |
| AI Frameworks Engineer | Poland, Gdansk | — | 2026-10-26 |
| AI Frameworks Engineer | Poland, Gdansk | — | 2026-10-26 |
| AI Frameworks Engineer - Intern | Mexico, Guadalajara | — | 2026-10-26 |
| AI Frameworks Engineer - Intern | Poland, Gdansk | — | 2026-10-26 |
| AI Frameworks Intern | Poland, Gdansk | — | 2026-10-26 |
| AI GPU Arch Perf Analysis Intern | PRC, Beijing | — | 2026-10-26 |
| AI GPU Arch Perf Optimization Intern | PRC Shanghai | — | 2026-10-26 |
| AI GPU Cache Designer | US California Santa Clara | — | 2026-10-26 |
| AI GPU Power Delivery Pathfinding Researcher | US, Oregon, Hillsboro | — | 2026-10-26 |
| AI Hardware Engineering Intern | US California Santa Clara | — | 2026-10-26 |
| • AI/ML CAD Engineer, RTL & Design Verification | US Texas Austin | — | 2026-10-26 |
| AI Model Optimization Engineer | India, Bangalore | — | 2026-10-26 |
| AI Model Optimization Engineer | US, California, Santa Clara | — | 2026-10-26 |
| AI Model Optimization Engineer | Malaysia, Penang | — | 2026-10-26 |
| AI Performance Library Architect | US Oregon Hillsboro | — | 2026-10-26 |
| AI Platform and Agentic Engineer | India, Bangalore | — | 2026-10-26 |
| AI SOC Power Delivery Pathfinding PhD Intern | US, Oregon, Hillsboro | — | 2026-10-26 |
| AI Software Architect | India, Bangalore | — | 2026-10-26 |
| AI Software Development Engineer | India, Bangalore | — | 2026-10-26 |
| AI Software Development Engineer | PRC, Shanghai | — | 2026-10-26 |
| AI Software Development Intern | Poland, Gdansk | — | 2026-10-26 |
| AI Software Engineering - Workloads Validation Intern | Poland, Gdansk | — | 2026-10-26 |
| AI Software Engineer Intern | PRC, Shanghai | — | 2026-10-26 |
| AI Software Solutions Engineer | India, Bangalore | — | 2026-10-26 |
| AI Software Validation Engineer | Poland, Gdansk | — | 2026-10-26 |
| AI Solution Architect - Graduate Intern | US, California, Santa Clara | — | 2026-10-26 |
| AI Solution Architect Graduate Intern | US, California, Santa Clara | — | 2026-10-26 |
| AI System Performance Engineer | India, Bangalore | — | 2026-10-26 |
| AMHS Equipment Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| AMHS Module Equipment Technician | Ireland, Leixlip | — | 2026-10-26 |
| Analog Circuit Design Engineer | India, Bangalore | — | 2026-10-26 |
| Analog Circuit Design Engineer | India, Bangalore | — | 2026-10-26 |
| Analog Circuit Design Engineer | India, Bangalore | — | 2026-10-26 |
| Analog Circuit Design Engineering Manager | India, Bangalore | — | 2026-10-26 |
| Analog Design Engineer | India, Bangalore | — | 2026-10-26 |
| Analytical Chemistry Lab Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| APTD_SWA S5 Manufacturing Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| APTM NPI Integration | US, New Mexico, Albuquerque | — | 2026-10-26 |
| APTM Yield Analysis/Device Engineer | US, New Mexico, Albuquerque | — | 2026-10-26 |
| Assembly Equipment Specialist | Vietnam, Ho_Chi_Minh_City | — | 2026-10-26 |
| Assembly Handling Systems Development Engineer | Malaysia, Kulim | — | 2026-10-26 |
| ATD Laser Development Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Atom CPU Layout Design Engineer | Mexico, Guadalajara | — | 2026-10-26 |
| Automated Functional Validation Engineer (Temporary position) | Mexico, Guadalajara | — | 2026-10-26 |
| Automated Material Handling System (AMHS) Equipment Technician | US, New Mexico, Albuquerque | — | 2026-10-26 |
| Automated Material Handling System (AMHS) Equipment Technician | US, New Mexico, Albuquerque | — | 2026-10-26 |
| Automation Operations Infrastructure Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| AutoTEM technician | US, Oregon, Hillsboro | — | 2026-10-26 |
| Back-End TD Reliability Lab Manager | US, Arizona, Phoenix | — | 2026-10-26 |
| BIOS Firmware Development Engineer | India, Bangalore | — | 2026-10-26 |
| Board Level Power Delivery Design Engineer | India, Bangalore | — | 2026-10-26 |
| Business Development Lead, Neuromorphic Computing | US California Santa Clara | — | 2026-10-26 |
| CAD/EDA Tools Automation Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| CAD/EDA Tools Automation Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| CAD/EDA Tools Software Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Calibration Lab Engineer | Vietnam, Ho_Chi_Minh_City | — | 2026-10-26 |
| CBS E2E Finance Architect | US Arizona Phoenix | — | 2026-10-26 |
| CDAT Manufacture Technician | PRC, Chengdu | — | 2026-10-26 |
| Chassis IP Design Engineer | India, Bangalore | — | 2026-10-26 |
| Chassis IP Senior Design Engineer | India, Bangalore | — | 2026-10-26 |
| Circuit Design Engineer | US, California, Folsom | — | 2026-10-26 |
| Cloud and AI System Engineer | PRC, Shanghai | — | 2026-10-26 |
| Cloud Software Development Engineer | India, Bangalore | — | 2026-10-26 |
| Cloud Software Development Engineer | India, Bangalore | — | 2026-10-26 |
| Cloud Software Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Cloud Software Development Engineer with uArch Expertise- Temporary position | Mexico, Guadalajara | — | 2026-10-26 |
| CMP Commodity Manager | US Oregon Hillsboro | — | 2026-10-26 |
| Collection Project Management Analyst | PRC Shanghai | — | 2026-10-26 |
| Compiler Engineer | PRC, Shanghai | — | 2026-10-26 |
| Compiler Engineer | Poland, Gdansk | — | 2026-10-26 |
| Compiler Engineering Graduate Intern | Canada, Toronto | — | 2026-10-26 |
| Compiler Engineering Intern | PRC, Shanghai | — | 2026-10-26 |
| Compiler Engineering Intern | Poland, Gdansk | — | 2026-10-26 |
| Compiler Engineering Intern | Canada, Toronto | — | 2026-10-26 |
| Compiler Performance Engineer | PRC, Shanghai | — | 2026-10-26 |
| Construction and Tool Install Project Manager (Contract) | Malaysia, Kulim | — | 2026-10-26 |
| Construction Contracts Manager | US, Ohio, New Albany | — | 2026-10-26 |
| Construction Finance Analyst | Israel, Kiryat-Gat | — | 2026-10-26 |
| Construction Project Design Manager (Contract) | Malaysia, Kulim | — | 2026-10-26 |
| Construction Project Manager | Malaysia Penang | — | 2026-10-26 |
| Construction Project Manager | US, Arizona, Phoenix | — | 2026-10-26 |
| Construction Project Manager | Israel Haifa | — | 2026-10-26 |
| Construction Tool Install Engineer (Contract) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Construction Tool Install Engineer (Contract) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Construction Tool Install Engineer (Contract) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix | — | 2026-10-26 |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix | — | 2026-10-26 |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix | — | 2026-10-26 |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix | — | 2026-10-26 |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix | — | 2026-10-26 |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix | — | 2026-10-26 |
| Construction Tool Install Technician/Too Owner (Thin Films/TF Dielectrics) | US, Arizona, Phoenix | — | 2026-10-26 |
| Contract Logistics Commodity Manager | Malaysia, Penang | — | 2026-10-26 |
| CPU Circuit Design Engineer | India, Bangalore | — | 2026-10-26 |
| CPU Circuit Design Engineer | US, Texas, Austin | — | 2026-10-26 |
| CPU Circuit Design Lead | India, Bangalore | — | 2026-10-26 |
| CPU Clock Design Engineer | US Texas Austin | — | 2026-10-26 |
| CPU Clock Design Lead | India, Bangalore | — | 2026-10-26 |
| CPU Design Verification Engineer | Malaysia, Penang | — | 2026-10-26 |
| CPU DFT Manager | India, Bangalore | — | 2026-10-26 |
| CPU Floorplan Lead | India, Bangalore | — | 2026-10-26 |
| CPU Front-end Design Manager | India, Bangalore | — | 2026-10-26 |
| CPU HVM Functional-Test Verification Engineer | Malaysia, Penang | — | 2026-10-26 |
| CPU Performance Architect | India, Bangalore | — | 2026-10-26 |
| CPU Physical Design Engineer | US, Texas, Austin | — | 2026-10-26 |
| CPU Physical Design Engineer | US, Texas, Austin | — | 2026-10-26 |
| CPU Physical Design Engineer | India, Bangalore | — | 2026-10-26 |
| CPU Physical Design Engineer | India, Bangalore | — | 2026-10-26 |
| CPU power Architect | Israel, Haifa | — | 2026-10-26 |
| CPU Power Delivery Engineer | India, Bangalore | — | 2026-10-26 |
| CPU Power Management and Performance Architect | US California Folsom | — | 2026-10-26 |
| CPU Pre-Silicon Verification Lead | India, Bangalore | — | 2026-10-26 |
| CPU Pre-Si Verification Engineer | Mexico, Guadalajara | — | 2026-10-26 |
| CPU Pre-Si Verification Sr Engineer | Mexico, Guadalajara | — | 2026-10-26 |
| CPU Senior Clock Design Engineer | India, Bangalore | — | 2026-10-26 |
| CPU Senior Floor Plan Engineer | India, Bangalore | — | 2026-10-26 |
| CPU Senior Floor Plan Engineer | India, Bangalore | — | 2026-10-26 |
| CPU Senior Timing Engineer | India, Bangalore | — | 2026-10-26 |
| CPU–SoC Mask Layout Designer (Diploma Level Contract role) - Silicon Engineering Group (SiG) | Malaysia Penang | — | 2026-10-26 |
| CPU Verification Engineer | US, Texas, Austin | — | 2026-10-26 |
| CUF TD Module Engineer | Malaysia, Kulim | — | 2026-10-26 |
| Data center SW Engineering | PRC, Shanghai | — | 2026-10-26 |
| Data Science and Analytics - PhD Intern | US, Oregon, Hillsboro | — | 2026-10-26 |
| Deep Learning Hardware Engineer | US California Santa Clara | — | 2026-10-26 |
| Defect Characterization Low Yield Analysis Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Defect Metrology Tool Install Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Defect Review Technician (Contract) | Malaysia, Penang | — | 2026-10-26 |
| Design Automation Engineer - Neuromorphic Computing | US Oregon Hillsboro | — | 2026-10-26 |
| Design Automation Engineer (TFM/EDA) | US California Folsom | — | 2026-10-26 |
| Design Verification Engineer | US California Santa Clara | — | 2026-10-26 |
| Design Verification Engineer | US, California, Santa Clara | — | 2026-10-26 |
| Design Verification Graduate Intern 2027 | US Colorado Fort Collins | — | 2026-10-26 |
| Development Tools Software Engineer Intern (m/f/d) | Germany, Munich | — | 2026-10-26 |
| Device Engineer | Ireland, Leixlip | — | 2026-10-26 |
| DevOps Engineering Intern | Poland, Gdansk | — | 2026-10-26 |
| DevOps Engineering Intern | Poland, Gdansk | — | 2026-10-26 |
| DevOps Software Engineering Intern | Poland, Gdansk | — | 2026-10-26 |
| DFT Design Engineer | India, Bangalore | — | 2026-10-26 |
| DFT Design Engineering Intern | Malaysia, Penang | — | 2026-10-26 |
| DFT Engineer / GPU Logic Design Engineer | India, Bangalore | — | 2026-10-26 |
| Diagnostics Firmware Engineer | India, Bangalore | — | 2026-10-26 |
| Die Prep Module Engineer (Contract Role) | Malaysia, Kulim | — | 2026-10-26 |
| Director, Business HR – APJ | Malaysia Penang | — | 2026-10-26 |
| Director, Government Affairs China | PRC, Beijing | — | 2026-10-26 |
| Director - Intel Foundry Pre-Silicon Design Quality and Reliability | US Oregon Hillsboro | — | 2026-10-26 |
| Director of Data Governance and Operations | US California Folsom | — | 2026-10-26 |
| Director of Global Customer Planning and Operations | US California Santa Clara | — | 2026-10-26 |
| Director of Supply Planning - Assembly, Test, and Materials | Malaysia, Kulim | — | 2026-10-26 |
| Director, Process Engineer – Dry Etch | US Oregon Hillsboro | — | 2026-10-26 |
| Director, Silicon Design Engineering | US California Santa Clara | — | 2026-10-26 |
| Director, Silicon Photonics - Business Development | US California Santa Clara | — | 2026-10-26 |
| Director, SoC Design Engineering | US California Santa Clara | — | 2026-10-26 |
| Discoverability Lead (GEO/AEO/SEO) | US California Santa Clara | — | 2026-10-26 |
| Display Technology Enabling Engineer | Taiwan, Taipei | — | 2026-10-26 |
| E-Core (Atom) CPU Layout Design Engineer | Malaysia Penang | — | 2026-10-26 |
| E-Core (Atom) CPU Layout Design Engineer | Malaysia Penang | — | 2026-10-26 |
| E-core CPU Clock Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-Core CPU Design Automation Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-Core CPU Design Automation Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core CPU Design Manager | Malaysia, Penang | — | 2026-10-26 |
| E-core CPU Full Chip Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core CPU Layout Design Engineer | Malaysia Penang | — | 2026-10-26 |
| E-core CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core CPU Power Delivery Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core Senior CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core Senior CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core Senior CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| E-core Senior CPU Physical Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| Ecosystem Technical Enabling Engineer | Mexico, Guadalajara | — | 2026-10-26 |
| Ecosystem Technical Enabling Engineer | Taiwan, Taipei | — | 2026-10-26 |
| Ecosystem Technical Enabling Engineer(SH/BJ) | PRC Shanghai | — | 2026-10-26 |
| Ecosystem Technical Enabling Engineer(SZ/SH) | PRC Shenzhen | — | 2026-10-26 |
| EDA Design Automation Engineer | Malaysia, Penang | — | 2026-10-26 |
| EDA Tools Hardware Engineer | India, Bangalore | — | 2026-10-26 |
| EDA Tools Hardware Engineer | US California Santa Clara | — | 2026-10-26 |
| EDA Tools Software Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| EHS Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| EMIB-T Substrate Yield Lead | US, Arizona, Phoenix | — | 2026-10-26 |
| Emulation Engineer | Virtual India | — | 2026-10-26 |
| Emulation Engineer | Virtual India | — | 2026-10-26 |
| Engineering Director, Automated Material Handling Systems | US, Arizona, Phoenix | — | 2026-10-26 |
| Enterprise Systems Analyst | US Arizona Phoenix | — | 2026-10-26 |
| (Epi) - Module Development Engineer - (PhD Intern) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Equipment Development Engineer | Japan, Tokyo | — | 2026-10-26 |
| Ethernet System Integration Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Ethernet System Integration Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Executive Admin | US, California, Santa Clara | — | 2026-10-26 |
| Executive Administrative Assistant and Office Manager | US, Washington, D.C. | — | 2026-10-26 |
| Experienced Security Software development Engineer | Israel, Haifa | — | 2026-10-26 |
| Facilities Electrical Internship program | Malaysia, Penang | — | 2026-10-26 |
| Facilities Engineering Intern | Vietnam, Ho_Chi_Minh_City | — | 2026-10-26 |
| Facilities Engineering Intern (Total Gas Chemical Management) | Malaysia, Penang | — | 2026-10-26 |
| Facilities Instrumentation and Controls Engineer | Malaysia, Penang | — | 2026-10-26 |
| Facilities Life Safety Systems (LSS) Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Facilities Mechanical Engineer | Malaysia, Penang | — | 2026-10-26 |
| Facilities Mechanical Engineer | Malaysia, Kulim | — | 2026-10-26 |
| Facilities Mechanical Engineer | Malaysia, Penang | — | 2026-10-26 |
| Facilities Mechanical Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| Facilities Power Distribution Electrical Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Facilities Services - Intern, Bachelor’s | US Oregon Hillsboro | — | 2026-10-26 |
| Facilities Services - Intern, Graduate | US Oregon Hillsboro | — | 2026-10-26 |
| Facilities Site Manager | US, Arizona, Phoenix | — | 2026-10-26 |
| Facilities Technician Intern | US, New Mexico, Albuquerque | — | 2026-10-26 |
| Facilities Water/Waste Treatment Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| FCO Strategic/Development Functional Area Industrial Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| FFEO FORGE Technical Leads Exhaust Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Finance Construction Settlement and Supply Chain Analyst - Americas | US, Arizona, Phoenix | — | 2026-10-26 |
| Finance Intern | Malaysia, Penang | — | 2026-10-26 |
| Finance Intern | Malaysia, Kulim | — | 2026-10-26 |
| Firmware and Development Tools Intern | PRC Shanghai | — | 2026-10-26 |
| Formal Verification Engineer | India, Bangalore | — | 2026-10-26 |
| Formal Verification Engineer | Israel Haifa | — | 2026-10-26 |
| Foundry Advanced Packaging Customer Engineer | US Arizona Phoenix | — | 2026-10-26 |
| Foundry Cloud Services Developer | US Oregon Hillsboro | — | 2026-10-26 |
| Foundry Device Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| Foundry New Deal Ops Integration Lead (Backend Logistics) | Malaysia, Penang | — | 2026-10-26 |
| Foundry Operations Oversight Manufacturing Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| Foundry Program Manager, Service Operations and Program Management | PRC Chengdu | — | 2026-10-26 |
| Foundry Services Director Segment Marketing | US California Santa Clara | — | 2026-10-26 |
| Global Construction EHS Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Global Retail Marketing Strategy Leader, Consumer and Gaming | US Oregon Hillsboro | — | 2026-10-26 |
| Government Affairs Program Specialist | Virtual Malaysia | — | 2026-10-26 |
| Government and Public Affairs: Community Engagement Manager | US, Ohio, New Albany | — | 2026-10-26 |
| GPU AI Solution Architect | US Oregon Hillsboro | — | 2026-10-26 |
| GPU Design Verification Engineer | US California Santa Clara | — | 2026-10-26 |
| GPU Design Verification Engineer | US California Santa Clara | — | 2026-10-26 |
| GPU Design Verification Engineer | US, California, Folsom | — | 2026-10-26 |
| GPU Design Verification Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Design Verification Engineer | Costa Rica, San Jose | — | 2026-10-26 |
| GPU Design Verification Engineer | US California Santa Clara | — | 2026-10-26 |
| GPU Design Verification Engineer | US, California, Folsom | — | 2026-10-26 |
| GPU Design Verification Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Engineering Manager | US California Santa Clara | — | 2026-10-26 |
| GPU IP Integration Model Build Engineer | India, Bangalore | — | 2026-10-26 |
| GPU IP Lead Emulation Model Build Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Logic Design Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Logic Design Engineer | US California Santa Clara | — | 2026-10-26 |
| GPU Logic Design Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Logic Design Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Micro-architect | US, California, Folsom | — | 2026-10-26 |
| GPU Physical Design Engineer | Costa Rica, San Jose | — | 2026-10-26 |
| GPU Senior Logic Design Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Software Development Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Software Development Engineer | US, California, Folsom | — | 2026-10-26 |
| GPU Software Development Engineer | US California Folsom | — | 2026-10-26 |
| GPU Software Development Engineer | India, Bangalore | — | 2026-10-26 |
| GPU Software Engineer | US, California, Folsom | — | 2026-10-26 |
| GPU Software Engineer | US, California, Folsom | — | 2026-10-26 |
| GPU Software Engineering Intern | Poland, Gdansk | — | 2026-10-26 |
| GPU Software Engineering Intern | Poland, Gdansk | — | 2026-10-26 |
| GPU Software Performance Intern | Poland, Gdansk | — | 2026-10-26 |
| GPU Validation Engineer | US California Folsom | — | 2026-10-26 |
| Graduate Talent (CPU-SoC Silicon Design) | Malaysia Penang | — | 2026-10-26 |
| Graduate Talent (E-core CPU Physical Design) | Malaysia, Penang | — | 2026-10-26 |
| Graduate Talent (ISCP SoC Front End Team) | Malaysia, Penang | — | 2026-10-26 |
| Graduate Talent (ISCP SoC Front End Team) | Malaysia, Penang | — | 2026-10-26 |
| Graduate Talent (Software Application Development Engineer) | Malaysia, Penang | — | 2026-10-26 |
| Graduate Talent (Software Application Development Engineer) | Malaysia Penang | — | 2026-10-26 |
| Graphics Hardware Validation Undergraduate Engineering Intern | Canada, Toronto | — | 2026-10-26 |
| Hardware Design Engineer (Temporary position) | Mexico, Guadalajara | — | 2026-10-26 |
| Hardware Engineer | US, California, Santa Clara | — | 2026-10-26 |
| HPC and Financial Workload Optimization Engineer | PRC, Shanghai | — | 2026-10-26 |
| HPC System Architecture | US California Santa Clara | — | 2026-10-26 |
| IA Core Post Silicon Validation Engineer | US, Texas, Austin | — | 2026-10-26 |
| ICE Graduate Talent | Malaysia Penang | — | 2026-10-26 |
| Identity Security - PKI Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Industrial Engineer - Foundry Strategic Capacity | US Arizona Phoenix | — | 2026-10-26 |
| Industrial Security Representative 1 | US, Oregon, Hillsboro | — | 2026-10-26 |
| Information Security Engineer Undergraduate Intern | US, California, Folsom | — | 2026-10-26 |
| Infrastructure Storage Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Infrastructure Systems Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Install Qualification Operations Specialist (contract) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Install Qualification Operations Specialist (contract) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Install Qualification Operations Specialist (Contract) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Install Qualification Operations Specialist (Contract) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Install Qualification Operations Sr Specialist (Contract) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Advanced Device Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Advanced Device Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Advanced Device Development Engineer | Taiwan, Taipei | — | 2026-10-26 |
| Intel Foundry Advanced Device Development Engineer | Taiwan, Taipei | — | 2026-10-26 |
| Intel Foundry Advanced Device Development Engineering Manager | US Oregon Hillsboro | — | 2026-10-26 |
| Intel Foundry LTD Product Yield Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| Intel Foundry Module Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Module Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Module Development Engineer - CMP | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry/PCC Semiconductor Manufacturing Student Technician – ICE Program | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Principal Engineer Overlay Development Engineer - Lithography | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Process Development Engineer - Lithography | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel Foundry Senior Customer Quality Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| Intel Foundry Strategic Marketing | US California Santa Clara | — | 2026-10-26 |
| Intel Foundry Strategic Marketing | US California Santa Clara | — | 2026-10-26 |
| Intel Mask Operations Module Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Intel NPU Internship | Ireland, Leixlip | — | 2026-10-26 |
| Intern C++ Developer - Graphics Compute Driver (AI, HPC) | Poland, Gdansk | — | 2026-10-26 |
| Intern Software QA Test Engineer | Poland, Gdansk | — | 2026-10-26 |
| Intern System Software Development Engineer | Malaysia, Kulim | — | 2026-10-26 |
| IP Design Verification Engineer | US California Santa Clara | — | 2026-10-26 |
| IP RTL Senior Design Engineer | India, Bangalore | — | 2026-10-26 |
| Ireland Site Industrial Engineer | Ireland, Leixlip | — | 2026-10-26 |
| Lab Engineer | India, Bangalore | — | 2026-10-26 |
| Lab Engineering Power Technician | US Oregon Hillsboro | — | 2026-10-26 |
| Lab Operations Manager | Canada, Toronto | — | 2026-10-26 |
| Lead Cloud Software Development Engineer with uArch Expertise- Temporary Position | Mexico, Guadalajara | — | 2026-10-26 |
| Lead Humanoid Robotics System Architect | US Oregon Hillsboro | — | 2026-10-26 |
| Lead Simulation Architect | India, Bangalore | — | 2026-10-26 |
| Lithography Tool Install Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| LLM & Agentic AI Performance Engineer | India, Bangalore | — | 2026-10-26 |
| Load Balancer Network Engineer | US California Santa Clara | — | 2026-10-26 |
| Logic Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| Logistics Operations Manager for Customs compliance operations | Vietnam, Ho_Chi_Minh_City | — | 2026-10-26 |
| Logistics Operations Manager (Transportation) (Contract) | Malaysia, Penang | — | 2026-10-26 |
| Low-Level Software Engineer | India, Bangalore | — | 2026-10-26 |
| Low Yield Analysis Engineer on Shift | US, Oregon, Hillsboro | — | 2026-10-26 |
| LTD Advanced Device Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| LTD Product Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| LVS Runset Development Engineer | India, Bangalore | — | 2026-10-26 |
| Malaysia Communications Manager | Malaysia, Penang | — | 2026-10-26 |
| Manufacturing and Process Development - Intern, Bachelor’s | US Oregon Hillsboro | — | 2026-10-26 |
| Manufacturing and Process Development - Intern, Graduate | US Oregon Hillsboro | — | 2026-10-26 |
| Manufacturing Equipment Engineering Manager (Assembly) | Malaysia, Penang | — | 2026-10-26 |
| Manufacturing Equipment Technician (MTE) - Back End Nights Shift - Shift 6 | US, Arizona, Phoenix | — | 2026-10-26 |
| Manufacturing Equipment Technician (MTE) - Days Backend Shift - Shift 7 | US, Arizona, Phoenix | — | 2026-10-26 |
| Manufacturing Equipment Technician (MTE) - Day Shift - Shift 5 | US, Arizona, Phoenix | — | 2026-10-26 |
| Manufacturing Operations Manager (Contract) | Malaysia, Kulim | — | 2026-10-26 |
| Manufacturing Operations Manager Day Shift - Advanced Packaging | US, Arizona, Phoenix | — | 2026-10-26 |
| Manufacturing Operator (Contract) | Malaysia, Kulim | — | 2026-10-26 |
| Manufacturing Operator (Nhân viên vận hành máy) | Vietnam, Ho_Chi_Minh_City | — | 2026-10-26 |
| Manufacturing Operators | Malaysia, Kulim | — | 2026-10-26 |
| Manufacturing Quality and Reliability Engineer | Malaysia, Penang | — | 2026-10-26 |
| Manufacturing Systems Software Development Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| Manufacturing Systems Software Development Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| Manufacturing Technician | Vietnam, Ho_Chi_Minh_City | — | 2026-10-26 |
| Manufacturing Technician | Vietnam, Ho_Chi_Minh_City | — | 2026-10-26 |
| Manufacturing Technician Internship | Ireland, Leixlip | — | 2026-10-26 |
| Marketing Campaign Specialist, Global Consumer and Gaming | US Texas Austin | — | 2026-10-26 |
| Materials Program Manager (Contract) | US Oregon Hillsboro | — | 2026-10-26 |
| Mechanical Engineer | Malaysia, Penang | — | 2026-10-26 |
| Media AI Software Intern | Poland, Gdansk | — | 2026-10-26 |
| Member of Technical Staff - Thin Films Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Memory Circuit Design Engineer | US, Texas, Austin | — | 2026-10-26 |
| Memory Circuit Design Engineer | US, Texas, Austin | — | 2026-10-26 |
| Memory Electrical Validation Engineer | India, Bangalore | — | 2026-10-26 |
| Memory Electrical Validation Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Memory Firmware Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Memory Layout Manager | India, Bangalore | — | 2026-10-26 |
| Memory Signal Integrity Engineer | Costa Rica, San Jose | — | 2026-10-26 |
| Mfg Systems Software Development Engineer | Malaysia, Kulim | — | 2026-10-26 |
| Microarchitecture and Design Engineer - AI SoC | India, Bangalore | — | 2026-10-26 |
| Microarchitecture and Design Engineer - AI SoC | US California Santa Clara | — | 2026-10-26 |
| Middleware Software Engineering Intern | Poland, Gdansk | — | 2026-10-26 |
| Mid-level Physical Design Engineer CPU | US, Oregon, Hillsboro | — | 2026-10-26 |
| Mixed Signal Design Verification Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| Mixed Signal IP Verification Engineer | India, Bangalore | — | 2026-10-26 |
| Mixed Signal Logic Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| MLIR Compiler Engineering Graduate Intern (f/m/d) | Germany, Munich | — | 2026-10-26 |
| MLIR Compiler Engineering Undergraduate Intern (f/m/d) | Germany, Munich | — | 2026-10-26 |
| Module Development Defect Metrology Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Development Engineer - CMP | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Development Engineering Manager | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Development Engineer - LTD Dry Etch | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Development Engineer (Ph.D.) - Intel Foundry | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Development Engineer PhD Intern New 2027 | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Development Engineer - RF Test | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Development Engineer - RF Test | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineer | Malaysia, Penang | — | 2026-10-26 |
| Module Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineer | Malaysia, Penang | — | 2026-10-26 |
| Module Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineer (Contract) | Malaysia, Penang | — | 2026-10-26 |
| Module Engineering - Day Shift 5 or 7 | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineering - Day Shift 5 or 7 | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineering (PhD Intern) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering - PhD Intern | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering PhD Intern | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering PhD Intern | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering PhD Intern 2027 | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering - PhD Intern (Advanced Wet Etch and Cleans) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering PhD Intern New 2027 | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering PhD Intern New 2027 | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering - PhD Intern (Wet Etch) | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineering PhD Intern - Wet Etch | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Engineer Internship | Ireland, Leixlip | — | 2026-10-26 |
| Module Engineer On Shift (MEOS) | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineer On-Shift (MEOS) – Day Shift (5) | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineer On-Shift (MEOS) – Day Shift (7) | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineer On-Shift (MEOS) – Night Shift (4) | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineer On-Shift (MEOS) – Night Shift (6) | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Engineer PhD Intern New 2027 | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Equipment Technician | Malaysia, Penang | — | 2026-10-26 |
| Module Equipment Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Equipment Technician | Malaysia, Kulim | — | 2026-10-26 |
| Module Equipment Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| Module Equipment Technician (Contract) | Malaysia, Kulim | — | 2026-10-26 |
| Module Equipment Technician (Contract) | Malaysia, Kulim | — | 2026-10-26 |
| Module Equipment Technician (Contract) | Malaysia Penang | — | 2026-10-26 |
| Module Equipment Technician (Contract) | Malaysia, Penang | — | 2026-10-26 |
| Module Equipment Technician (Contract) | Malaysia, Kulim | — | 2026-10-26 |
| Module Equipment Technician (Contract) | Malaysia, Penang | — | 2026-10-26 |
| Module Equipment Technician (Kỹ Thuật Viên Bảo trì Sửa chữa) | Vietnam, Ho_Chi_Minh_City | — | 2026-10-26 |
| Module Equipment Technician, Night Shift 6 | US, Oregon, Hillsboro | — | 2026-10-26 |
| Module Equipment Technician (Preventive Maintenance, Contract) | Malaysia, Penang | — | 2026-10-26 |
| Networking Hardware Product Manager | US Oregon Hillsboro | — | 2026-10-26 |
| Network Silicon Architect | Ireland, Leixlip | — | 2026-10-26 |
| Neuromorphic Front-End Silicon Lead | US Oregon Hillsboro | — | 2026-10-26 |
| New Mexico Site Automation Integrator | US, New Mexico, Albuquerque | — | 2026-10-26 |
| New Mexico WPM Manufacturing Technician Internship | US, New Mexico, Albuquerque | — | 2026-10-26 |
| NPI Engineer | Malaysia, Kulim | — | 2026-10-26 |
| NPI Engineer | Malaysia, Penang | — | 2026-10-26 |
| OC Bulk Chemical Delivery Metrology Technician - Shift 7 | US, Arizona, Phoenix | — | 2026-10-26 |
| Occupational Health Nurse | Taiwan, Taipei | — | 2026-10-26 |
| Ocotillo Failure Analysis Engineer – TEM/Probing Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Failure Analysis Technician – TEM Prep | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication Defect Metrology Equipment Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication Defect Metrology Layer Owner | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication Defect Metrology Systems Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication Defect Metrology Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication DSIRE (Diffusion) Module Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication Senior Lithography Reticle Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication Vacuum Systems Group (VSG) Experienced Module Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication Yield Defect Metrology Shift Group Leader | US, Arizona, Phoenix | — | 2026-10-26 |
| Ocotillo Technology Fabrication Yield Integration Technician | US, Arizona, Phoenix | — | 2026-10-26 |
| OEM Partner GTM Enabling | Taiwan, Taipei | — | 2026-10-26 |
| Operations Research Engineer | US Arizona Phoenix | — | 2026-10-26 |
| Operations Research Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Operations Research, Engineering Analytics Graduate Intern | US, Arizona, Phoenix | — | 2026-10-26 |
| Operations Research Engineer Intern | PRC Shanghai | — | 2026-10-26 |
| Optical Systems and Manufacturing Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| ORAP Module Equipment Technician, Night Shift | US, Oregon, Hillsboro | — | 2026-10-26 |
| Oregon Advanced Packaging Module Engineer - Laser | US, Oregon, Hillsboro | — | 2026-10-26 |
| OTF Failure Analysis Technician - Night Shift | US, Arizona, Phoenix | — | 2026-10-26 |
| Package Design Electrical Engineer | Malaysia Penang | — | 2026-10-26 |
| Packaging Module Development Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Packaging Module Development Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Packaging Module Development Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Packaging Module Development Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Packaging Module Development Engineer | Malaysia, Kulim | — | 2026-10-26 |
| Packaging Module Development Engineer | Malaysia, Kulim | — | 2026-10-26 |
| Packaging Module Development Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Packaging Module Equipment Development Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Packaging Process Development Engineer | US, Arizona, Phoenix | — | 2026-10-26 |
| Partner Marketing Strategist - AI ISV | US California Santa Clara | — | 2026-10-26 |
| Payroll Business Analyst - Intel Contract Employee | US California Folsom | — | 2026-10-26 |
| Payroll Specialist (Contract) | Malaysia, Penang | — | 2026-10-26 |
| Payroll Specialist (Contract) | Malaysia, Penang | — | 2026-10-26 |
| PDK Engineer | India, Bangalore | — | 2026-10-26 |
| PDK Engineer | India, Bangalore | — | 2026-10-26 |
| PERC Rule Deck Development Engineer | India, Bangalore | — | 2026-10-26 |
| Photonic System Design Engineer | US, California, Santa Clara | — | 2026-10-26 |
| Physical AI Industry Solutions Manager | US Oregon Hillsboro | — | 2026-10-26 |
| Physical AI Solutions Architect | US Oregon Hillsboro | — | 2026-10-26 |
| Physical Design for PPA Optimization Engineer | Israel, Haifa | — | 2026-10-26 |
| Platform Hardware and Systems Engineering - Intern, Bachelor’s | US Oregon Hillsboro | — | 2026-10-26 |
| Platform Hardware and Systems Engineering - Intern, Graduate | US Oregon Hillsboro | — | 2026-10-26 |
| Platform Hardware design Engineer | India, Bangalore | — | 2026-10-26 |
| Platform Hardware Design Engineer | US, Oregon, Hillsboro | — | 2026-10-26 |
| Platform Hardware Design Engineer | Malaysia, Penang | — | 2026-10-26 |
| Platform Hardware Design Engineer | PRC, Shanghai | — | 2026-10-26 |
| Platform Integration Engineer | US, California, Santa Clara | — | 2026-10-26 |
| Platform Power Thermal Performance Engineer | PRC, Shanghai | — | 2026-10-26 |
| Platform Validation Engineering Intern | Mexico, Guadalajara | — | 2026-10-26 |
| Power Delivery Design Engineer | Canada, Toronto | — | 2026-10-26 |
| Power Integrity Engineer | Costa Rica, San Jose | — | 2026-10-26 |
| Power Management Firmware Architect | Israel Petah Tikva | — | 2026-10-26 |
| Power Management Firmware Development Team lead | Israel, Haifa | — | 2026-10-26 |
| Practical Engineering Student - Kiryat Gat | Israel, Kiryat-Gat | — | 2026-10-26 |
| Pre-Silicon SoC Validation - Technical Lead | India, Bangalore | — | 2026-10-26 |
| Pre-Silicon Verification Engineer | US Oregon Hillsboro | — | 2026-10-26 |
| Principal Engineer, AI Applied Research | US, Oregon, Hillsboro | — | 2026-10-26 |
| Principal Engineer- CPU Circuit Design | India, Bangalore | — | 2026-10-26 |